DocumentCode :
1077028
Title :
Analysis of Temperature in Phase Change Memory Scaling
Author :
Kim, SangBum ; Wong, H. S Philip
Author_Institution :
Stanford Univ., Stanford
Volume :
28
Issue :
8
fYear :
2007
Firstpage :
697
Lastpage :
699
Abstract :
We analyze constant-voltage isotropic and non-isotropic scaling issues for phase change memory (PCM) based on electrothermal physics. Various analytical and simulation models of general and typical PCM cells that support the analysis is also provided. The analysis shows that the maximum temperature in the PCM cell, which is a key parameter for PCM operation, is independent of geometrical sizes and depends only on the voltage and material properties. This leads to the minimum programming voltage concept, which is determined by material properties of the phase change material. Constant-voltage scaling, electrothermal modeling, ovonic unified memory (OUM), phase change memory (PCM, phase change random access memory, PRAM), proximity disturbance, thermal disturbance.
Keywords :
phase change materials; random-access storage; PCM materials; constant-voltage scaling; electrothermal physics; isotropic scaling; material properties; minimum programming voltage concept; nonisotropic scaling; phase change memory scaling; random access memory; temperature analysis; voltage properties; Analytical models; Crystallization; Electrothermal effects; Nonvolatile memory; Phase change materials; Phase change memory; Steady-state; Temperature dependence; Thermal conductivity; Voltage; Constant-voltage scaling; electrothermal modeling; ovonic unified memory (OUM); phase change memory (PCM, phase change random access memory, PRAM); proximity disturbance; thermal disturbance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2007.901347
Filename :
4278362
Link To Document :
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