• DocumentCode
    1077028
  • Title

    Analysis of Temperature in Phase Change Memory Scaling

  • Author

    Kim, SangBum ; Wong, H. S Philip

  • Author_Institution
    Stanford Univ., Stanford
  • Volume
    28
  • Issue
    8
  • fYear
    2007
  • Firstpage
    697
  • Lastpage
    699
  • Abstract
    We analyze constant-voltage isotropic and non-isotropic scaling issues for phase change memory (PCM) based on electrothermal physics. Various analytical and simulation models of general and typical PCM cells that support the analysis is also provided. The analysis shows that the maximum temperature in the PCM cell, which is a key parameter for PCM operation, is independent of geometrical sizes and depends only on the voltage and material properties. This leads to the minimum programming voltage concept, which is determined by material properties of the phase change material. Constant-voltage scaling, electrothermal modeling, ovonic unified memory (OUM), phase change memory (PCM, phase change random access memory, PRAM), proximity disturbance, thermal disturbance.
  • Keywords
    phase change materials; random-access storage; PCM materials; constant-voltage scaling; electrothermal physics; isotropic scaling; material properties; minimum programming voltage concept; nonisotropic scaling; phase change memory scaling; random access memory; temperature analysis; voltage properties; Analytical models; Crystallization; Electrothermal effects; Nonvolatile memory; Phase change materials; Phase change memory; Steady-state; Temperature dependence; Thermal conductivity; Voltage; Constant-voltage scaling; electrothermal modeling; ovonic unified memory (OUM); phase change memory (PCM, phase change random access memory, PRAM); proximity disturbance; thermal disturbance;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2007.901347
  • Filename
    4278362