DocumentCode
1077048
Title
Defect Passivation by Selenium-Ion Implantation for Poly-Si Thin Film Transistors
Author
Lai, Joanna ; Liu, Tsu-Jae King
Author_Institution
California Univ., berkeley
Volume
28
Issue
8
fYear
2007
Firstpage
725
Lastpage
727
Abstract
Low-dose (1013 cm-2) selenium-ion implantation prior to pulsed-excimer-laser crystallization is investigated as a low-thermal-budget defect-passivation technique for polycrystalline silicon TFTs. Selenium defect passivation is found to be effective for improving TFT performance and for providing superior TFT reliability as compared with hydrogenation. Ion implantation, passivation, polycrystalline silicon (poly-Si), selenium (Se), thin-film transistor (TFT).
Keywords
elemental semiconductors; ion implantation; selenium; semiconductor thin films; thin film transistors; Se - Element; Selenium-ion implantation; Si - Element; low-thermal-budget defect-passivation technique; poly-Si thin film transistors; pulsed-excimer-laser crystallization; Crystallization; Hydrogen; Lithography; Passivation; Plasma displays; Plasma temperature; Semiconductor films; Silicon compounds; Substrates; Thin film transistors; Ion implantation; passivation; polycrystalline silicon (poly-Si); selenium (Se); thin-film transistor (TFT);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2007.901275
Filename
4278364
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