Title : 
Mechanical and magnetic properties of a novel polymer infiltrated directionally solidified RE-Fe giant magnetostrictive materials
         
        
            Author : 
Kwon, Oh Yeoul ; Kwon, Yong Dong ; Kim, Do Hyung ; Kim, Jong Chul ; Lee, Zin Hyoung
         
        
            Author_Institution : 
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
         
        
        
        
        
            fDate : 
7/1/2004 12:00:00 AM
         
        
        
        
            Abstract : 
Newly developed polymer infiltrated grain aligned composite Terfenol-D has the advantages of maintaining the favorable crystal orientation of the directionally grown RFe2 phase. In order to infiltrate the polymer effectively, it is necessary to prepare composition with a low Fe content (0.64≤y≤1.7) in Tb0.33Dy0.67Fey. With decreasing Fe content, the amount of the eutectic phase increases which can be removed by annealing. This composite shows many improved properties compared with conventional composite or monolithic Terfenol-D material. Through this new material, high magnetostrictive strain can be obtained under relatively low magnetic field. In addition, it shows a considerably higher modulus of rupture of around 65∼92 MPa in four-point bend test.
         
        
            Keywords : 
crystal orientation; eutectic structure; magnetic fields; magnetic particles; magnetostrictive devices; mechanical properties; polymers; Fe; RE-Fe materials; Terfenol-D; annealing; crystal orientation; eutectic phase; magnetic field; magnetic properties; magnetostrictive materials; magnetostrictive strain; mechanical properties; polymer infiltrated grain; Annealing; Composite materials; Crystalline materials; Iron; Magnetic field induced strain; Magnetic materials; Magnetic properties; Magnetostriction; Polymers; Testing; Magnetostriction; PIGAC; RE–Fe materials; polymer infiltrated grain aligned composite; transducer;
         
        
        
            Journal_Title : 
Magnetics, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TMAG.2004.832148