DocumentCode
1077529
Title
Optimum semiconductors for power field effect transistors
Author
Baliga, B.J. ; Adler, M.S. ; Oliver, D.W.
Author_Institution
General Electric Company, Schenectady, New York
Volume
2
Issue
7
fYear
1981
fDate
7/1/1981 12:00:00 AM
Firstpage
162
Lastpage
164
Abstract
The optimization of semiconductor material properties for high voltage field effect transistors is discussed. The on-resistance of these devices is shown to be inversely proportional to the carrier mobility and inversely proportional to the cube of the energy band gap. Based upon this, the on-resistance of GaAs FETs is predicted to be at least twelve times smaller than that of present silicon FETs. Comparison of the projected GaAs FET power switching performance with competing silicon devices (MOSFETs, FCTs, GTOs, and bipolar transistors) indicates that the GaAs FET will have better switching efficiency at all operating frequencies for devices designed with breakdown voltages ranging from 200 to 1000 volts.
Keywords
Avalanche breakdown; Breakdown voltage; FETs; Frequency; Gallium arsenide; MOSFETs; Photonic band gap; Semiconductor device doping; Semiconductor materials; Silicon;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1981.25383
Filename
1481867
Link To Document