مرکز منطقه ای اطلاع رساني علوم و فناوري - Special issue on Compact Interconnect Models for Giga Scale Integration

DocumentCode :

1077647

Title :

Special issue on Compact Interconnect Models for Giga Scale Integration

Volume :

Issue :

fYear :

2009

Firstpage :

360

Lastpage :

360

Abstract :

Provides notice of upcoming special issue(s) of interest to practitioners and researchers.

fLanguage :

English

Journal_Title :

Electron Devices, IEEE Transactions on

Publisher :

ieee

ISSN :

0018-9383

Type :

jour

DOI :

10.1109/TED.2009.2013515

Filename :

4757348

Link To Document :