DocumentCode :
1077659
Title :
RF integrated noise suppressor using soft magnetic films
Author :
Kim, Ki Hyeon ; Ohnuma, Shigehiro ; Yamaguchi, Masahiro
Author_Institution :
Dept. of Electr. & Commun. Eng., Tohoku Univ., Japan
Volume :
40
Issue :
4
fYear :
2004
fDate :
7/1/2004 12:00:00 AM
Firstpage :
2838
Lastpage :
2840
Abstract :
RF integrated noise suppressors were fabricated by integration of soft magnetic films on coplanar transmission lines. The vertical structure of suppressor was composed of the magnetic film (2 mm×15 mm×1, 2 μm)/2-μm-thick polyimide/15.2-mm-long and 3-μm-thick Cu transmission line/seed layer (Ti/Cu)/1 mm-thick glass substrate. The coplanar transmission lines were prepared by electroplated Cu with 50 Ω-characteristic impedance. The width of the signal line was 50 μm. The magnetic films, e.g., CoPdAlO and CoNbZr films were deposited by rf magnetron sputtering. Compared with those of the nonintegrated noise suppressor, the magnitude of signal attenuation at resonance point of integrated noise suppressor greatly increased from - 4 to - 30 dB for the 1-μm-thick CoNbZr film, and from -15 to - 57 dB for the 2-μm-thick CoPdAlO film, respectively.
Keywords :
circuit noise; cobalt compounds; coplanar transmission lines; copper; electroplating; ferromagnetic resonance; magnetic microwave devices; magnetic thin films; soft magnetic materials; sputter deposition; 1 micron; 50 micron; CoNbZr; Cu; RF integrated noise suppressor; coplanar transmission lines; electroplating; ferromagnetic resonance; glass substrate; magnetron sputtering; seed layer; signal attenuation; signal line; soft magnetic films; Coplanar transmission lines; Glass; Impedance; Magnetic films; Magnetic noise; Magnetic resonance; Polyimides; Radio frequency; Soft magnetic materials; Substrates; Coplanar transmission; FMR; RF; ferromagnetic resonance; noise suppression; radio-frequency; soft magnetic film;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.2004.830474
Filename :
1325659
Link To Document :
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