• DocumentCode
    1077659
  • Title

    RF integrated noise suppressor using soft magnetic films

  • Author

    Kim, Ki Hyeon ; Ohnuma, Shigehiro ; Yamaguchi, Masahiro

  • Author_Institution
    Dept. of Electr. & Commun. Eng., Tohoku Univ., Japan
  • Volume
    40
  • Issue
    4
  • fYear
    2004
  • fDate
    7/1/2004 12:00:00 AM
  • Firstpage
    2838
  • Lastpage
    2840
  • Abstract
    RF integrated noise suppressors were fabricated by integration of soft magnetic films on coplanar transmission lines. The vertical structure of suppressor was composed of the magnetic film (2 mm×15 mm×1, 2 μm)/2-μm-thick polyimide/15.2-mm-long and 3-μm-thick Cu transmission line/seed layer (Ti/Cu)/1 mm-thick glass substrate. The coplanar transmission lines were prepared by electroplated Cu with 50 Ω-characteristic impedance. The width of the signal line was 50 μm. The magnetic films, e.g., CoPdAlO and CoNbZr films were deposited by rf magnetron sputtering. Compared with those of the nonintegrated noise suppressor, the magnitude of signal attenuation at resonance point of integrated noise suppressor greatly increased from - 4 to - 30 dB for the 1-μm-thick CoNbZr film, and from -15 to - 57 dB for the 2-μm-thick CoPdAlO film, respectively.
  • Keywords
    circuit noise; cobalt compounds; coplanar transmission lines; copper; electroplating; ferromagnetic resonance; magnetic microwave devices; magnetic thin films; soft magnetic materials; sputter deposition; 1 micron; 50 micron; CoNbZr; Cu; RF integrated noise suppressor; coplanar transmission lines; electroplating; ferromagnetic resonance; glass substrate; magnetron sputtering; seed layer; signal attenuation; signal line; soft magnetic films; Coplanar transmission lines; Glass; Impedance; Magnetic films; Magnetic noise; Magnetic resonance; Polyimides; Radio frequency; Soft magnetic materials; Substrates; Coplanar transmission; FMR; RF; ferromagnetic resonance; noise suppression; radio-frequency; soft magnetic film;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2004.830474
  • Filename
    1325659