DocumentCode
1077819
Title
Processability of thin-film, fine-line pattern on aluminum nitride substrates [for hybrids]
Author
Chanchani, Rajen
Author_Institution
AT&T Bell Lab., Allentown, PA, USA
Volume
11
Issue
4
fYear
1988
fDate
12/1/1988 12:00:00 AM
Firstpage
427
Lastpage
432
Abstract
The author investigated the processability of a thin-film line pattern, 76 μm, on AlN using sputter deposition and photolithography techniques. Results on the stability of AlN substrates in the processing environment, thin-film deposition, fine-line pattern generation, and laser scribability of AlN are reported. The surfaces of AlN substrates have been observed to decompose to an amorphous aluminum hydroxide phase when soaked in deionized water at 100°C for 30 min or longer. The surface of AlN was shown to oxidize rapidly to α-Al2O 3 when heated in air above 1000°C; this oxidized layer readily cracks during rapid cooling. AlN was found to be laser scribable. In this study, 53% of the circuits on AlN had opens as compared to none on Al2O3. This is attributed to the higher surface roughness of AlN, almost four times higher than that of Al2O3 substrates
Keywords
aluminium compounds; hybrid integrated circuits; laser beam machining; photolithography; sputter deposition; substrates; 100 degC; 76 micron; AlN; cracks; deionized water; fine-line pattern generation; laser scribability; photolithography techniques; rapid cooling; sputter deposition; surface roughness; thin-film line pattern; Aluminum nitride; Amorphous materials; Circuits; Cooling; Laser stability; Lithography; Sputtering; Substrates; Surface cracks; Transistors;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.16678
Filename
16678
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