• DocumentCode
    1077915
  • Title

    A Low-Frequency Accurate Cavity Model for Transient Analysis of Power-Ground Structures

  • Author

    Antonini, Giulio

  • Author_Institution
    Univ. degli Studi di L´´Aquila, L´´Aquila
  • Volume
    50
  • Issue
    1
  • fYear
    2008
  • Firstpage
    138
  • Lastpage
    148
  • Abstract
    With increased operating frequencies and circuit component density, signal and power integrity problems caused by voltage bounces have become more important for high-speed digital systems. This paper presents a systematic macromodeling of power-bus structures based on the cavity model: first, more accurate models are used to describe conductor and dielectric losses, thus improving accuracy at low frequencies; second, a rational model of the overall power/ground structure in the Laplace domain is presented, and third, the rational macromodel is used to identify the dominant poles, and a simplified SPICE-compatible equivalent circuit is synthesized by using only the selected poles. The numerical results confirm the correctness and effectiveness of the method.
  • Keywords
    conductors (electric); dielectric losses; equivalent circuits; integrated circuit modelling; printed circuit design; transient analysis; Laplace domain; Spice-compatible equivalent circuit; circuit component density; conductor; dielectric loss; frequency-dependent losses; low-frequency accurate cavity model; macromodeling; power distribution network; power-bus structure; power-ground structure; printed circuit board; switching noise; transient analysis; Conductors; Dielectric losses; Electromagnetic compatibility; Equivalent circuits; Finite difference methods; Frequency; Impedance; Integrated circuit noise; Power system modeling; Transient analysis; Cavity model; frequency-dependent losses; model-order reduction; power distribution network; simultaneous switching noise; transient analysis;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2007.915283
  • Filename
    4455654