DocumentCode :
107803
Title :
Settling Time and Noise Optimization of a Three-Stage Operational Transconductance Amplifier
Author :
Seth, Sachin ; Murmann, Boris
Author_Institution :
Department of Electrical Engineering, Stanford University, Stanford, CA, USA
Volume :
60
Issue :
5
fYear :
2013
fDate :
May-13
Firstpage :
1168
Lastpage :
1174
Abstract :
This paper presents the design and optimization of a nested-Miller compensated, three-stage operational transconductance amplifier (OTA) for use in switched-capacitor (SC) circuits. Existing design methods for three-stage OTAs often lead to sub-optimal solutions because they decouple inter-related metrics like noise and settling performance. In our approach, the problem of finding an optimal design with the best total integrated noise and settling time has been cohesively solved by formulating a nonlinear constrained optimization program. Equality, inequality, and semi-infinite constraints are formed using closed form symbolic expressions obtained by a closed loop analysis of the SC gain stage and the optimization program is solved by using the interior-point algorithm. For the optimization routine, there is no need to interface with a circuit simulator because all significant device parasitics are included in the model. The optimization and modeling steps are general in nature and can be applied to any amplifier or filter topology. Simulation results show that a 90-nm prototype amplifier achieves a \\pm 0.1{\\hbox {%}} dynamic error settling time of 2.5 ns with a total integrated noise of 240 \\mu {\\rm V}_{\\rm \\rms} , while consuming 5.2 mW from a 1-V power supply.
Keywords :
Circuit optimization; Integrated circuit noise; Power demand; Switched capacitor circuits; Thermal noise; Circuit optimization; integrated circuit noise; nested Miller compensation; switched-capacitor circuits; thermal noise; three-stage amplifier;
fLanguage :
English
Journal_Title :
Circuits and Systems I: Regular Papers, IEEE Transactions on
Publisher :
ieee
ISSN :
1549-8328
Type :
jour
DOI :
10.1109/TCSI.2013.2244325
Filename :
6487421
Link To Document :
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