DocumentCode
1078385
Title
Chip-package codesign of integrated voltage-controlled oscillator in LCP substrate
Author
Bavisi, Amit ; Dalmia, Sidharth ; Swaminathan, Madhavan ; White, George ; Sundaram, Venky
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
Volume
29
Issue
3
fYear
2006
Firstpage
390
Lastpage
402
Abstract
This paper presents the design and characterization of a negative resistance type 1.9-GHz oscillator using high quality factor (Q) embedded lumped-element LC passives in an organic-based substrate with liquid crystalline polymer (LCP) dielectric material. A design strategy using analytical models is implemented to determine the value of the base inductance subject to the constraints set by power dissipation. Additionally, the effect of component Qs on the phase noise is qualitatively discussed. This paper also addresses the effects of the parasitics of the surface-mount active devices on the noise spectrum of a negative resistance type voltage-controlled oscillator (VCO). The designed VCO is fully embedded in the LCP substrate and uses high Q on-package passive components. The VCO was measured to operate at 1.92 GHz dissipating 14 mW of dc power and measured a phase noise of -118dBc/Hz and -133 dBc/Hz at 600 KHz and 3-MHz offset, respectively. The high Q of the LC tank circuit was utilized to optimize the VCO to operate from a 2-V supply at bias current of 0.9 mA. Finally, the design and implementation issues in a 2.25-GHz Colpitt´s oscillator on LCP substrate are shown. The effects of scaling capacitance ratio on VCO phase noise and on power consumption are verified for the Colpitt´s oscillator
Keywords
UHF integrated circuits; UHF oscillators; chip scale packaging; liquid crystal polymers; surface mount technology; system-in-package; voltage-controlled oscillators; 0.9 mA; 1.9 GHz; 14 mW; 2 V; 2.25 GHz; Colpitt oscillator; LC tank circuit; LCP dielectric material; SOP; SiP; VCO; chip-package codesign; embedded lumped-element; integrated voltage-controlled oscillator; liquid crystalline polymer; on-package passive components; organic-based substrate; quality factor; surface-mount active devices; system-in-package; system-on-package; Crystallization; Dielectric substrates; Electrical resistance measurement; Noise measurement; Phase measurement; Phase noise; Power measurement; Q factor; Surface resistance; Voltage-controlled oscillators; Colpitt´s oscillator; liquid crystalline polymer (LCP); phase noise; system-in-package (SiP); system-on-package (SOP); voltage-controlled oscillator (VCO);
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2005.853550
Filename
1667856
Link To Document