Title :
Parallel optical transmitter module using angled fibers and a V-grooved silicon optical bench for VCSEL array
Author :
Hwang, Sung Hwan ; Seo, Dae Dong ; An, Jae Yong ; Kim, Myeong-Hyun ; Choi, Woo Chang ; Cho, Sung Ryul ; Lee, Sang Hwan ; Park, Hyo-Hoon ; Cho, Han Seo
Author_Institution :
Fionix Inc., Daejeon
Abstract :
We propose an advanced structure of optical subassembly (OSA) for packaging of the vertical-cavity surface-emitting laser (VCSEL) array, using (111) facet mirror of the V-groove ends formed in a silicon optical bench (SiOB) and angled fiber apertures. The feature of our OSA can provide a low optical crosstalk between neighboring channels, a low feedback reflection, and a large misalignment tolerance along the V-groove. We describe the optimized design of fiber angle, VCSEL position, and fiber position. The fabricated OSA structure consists of 12 channels of angled fiber array, 54.7deg V-grooves, Au-coated mirrors on (111) end facet of the V-grooves, and flip-chip-bonded VCSEL array on a SiOB. In this structure, the beam emitted from the VCSEL is deflected at the 54.7deg mirror of (111) end facet and propagated into the angled fiber. The angled fiber array was polished by 57deg. Fabricated OSAs showed a coupling efficiency of 30%-50% that is 25 times larger than that obtained from an OSA with a vertically flat fiber array. Our OSA showed large misalignment tolerance of about 90 mum along the longitudinal direction in the V-groove. We fabricated a parallel optical transmitter module using the OSA and demonstrated 12 channels times2.5 Gb/s data transmission with a clear eye diagram
Keywords :
fibre lasers; flip-chip devices; laser mirrors; optical crosstalk; optical transmitters; surface emitting lasers; V-grooved silicon optical bench; VCSEL array; angled fiber aperture; optical sub-assembly; optical subassembly; parallel optical transmitter module; passive alignment; vertical-cavity surface-emitting laser; Fiber lasers; Laser feedback; Mirrors; Optical arrays; Optical crosstalk; Optical feedback; Optical transmitters; Packaging; Silicon; Vertical cavity surface emitting lasers; Angled fiber; optical subassembly; parallel optical transmitter module; passive alignment; silicon optical bench (SiOB); vertical-cavity surface-emitting laser (VCSEL);
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2006.875078