Adhesive joint design for minimizing fiber alignment shift during UV curing

In fiber-optic device packaging using UV curable adhesive bonding, the curing process often causes fiber alignment shift-distortion of the already aligned fiber-optic setups, and thus reduce the assembly yield. A new method for the adhesive joint design for minimizing fiber alignment shift during adhesive curing is reported in this paper. It is demonstrated that for any adhesive, the bonding joint can be designed to alleviate the alignment shift, regardless of adhesives used. The approach provides guideline for high yield and low-cost assembly of fiber-optic devices using adhesive bonding