Title :
Noise reduction using compensation capacitance for bend discontinuities of differential transmission lines
Author :
Shiue, Guang-Hwa ; Guo, Wei-Da ; Lin, Chien-Min ; Wu, Ruey-Beei
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
Abstract :
Differential signaling has become a popular choice for multigigabit digital applications in favor of its low-noise generation and high common-mode noise immunity. Recalling from the full-wave solution of S-parameters, this paper presented a design methodology of analysis scheme to extract the equivalent circuits of discontinuities observed on the strongly coupled differential lines. Signal integrity effects of the bent differential transmission lines in a high-speed digital circuit were then simulated in the time domain. A dual back-to-back routing topology of bent differential lines to reduce the common-mode noise was further investigated. To alleviate the common-mode noise at the receiver, a novel compensation scheme in use of the shunt capacitance was also proposed. Furthermore, the comparison between the simulation and measured results validated the equivalent circuit model, coupled bends with compensation capacitance patch, and analysis approach
Keywords :
S-parameters; circuit noise; digital circuits; equivalent circuits; interference suppression; network routing; time-domain analysis; transmission lines; S-parameters; bend discontinuity; bent differential transmission; common-mode noise; compensation capacitance; design methodology; differential signaling; differential transmission lines; dual back-to-back routing; equivalent circuits; full-wave solution; multigigabit digital applications; noise reduction; shunt capacitance; strongly coupled differential lines; Capacitance; Circuit noise; Circuit simulation; Coupling circuits; Distributed parameter circuits; Equivalent circuits; Noise reduction; Signal generators; Transmission line discontinuities; Transmission lines; Common-mode noise; compensation capacitance; differential signaling; discontinuity; dual back-to-back coupled bends; mixed-mode; signal integrity; strongly coupled differential line;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2006.875413