• DocumentCode
    1078682
  • Title

    Automation of active quadrangular pyramid-shaped fiber endface polishing method

  • Author

    Tseng, Yih-Tun ; Liu, Jui-Hung ; Hung, Tzu-Yu ; Huang, Fu-Ping

  • Author_Institution
    Dept. of Mech. & Electro-Mech. Eng., Nat. Sun-Yat-Sen Univ., Kaohsiung
  • Volume
    29
  • Issue
    3
  • fYear
    2006
  • Firstpage
    599
  • Lastpage
    606
  • Abstract
    A high-power laser diode (LD) has an elliptical mode field at the endface of its laser diodes. A mode field mismatch between the high-power LD and single-mode fibers (SMFs) results in low coupling efficiency. Accordingly, various methods for coupling between the LD with the higher aspect ratio and SMFs have been employed. Among these approaches, the quadrangular pyramid-shaped fiber endface (QPSFE), which has the capability to control both axial curvatures, can easily match the far field of the high-power LD. However, a QPSFE, which was fabricated by polishing techniques, is hard to employ because of the special shape involved and the need for high precision. This paper presents a novel method for automating QPSFE polishing based on a thorough system analysis and using an online image inspection system. The system successfully supported automatic polishing with an encouraged fiber tip offset that ensures high coupling efficiency. Such an automatic polishing system can also be applied to any other type of fiber endface
  • Keywords
    automatic optical inspection; computer aided manufacturing; optical fibre fabrication; polishing; semiconductor lasers; QPSFE polishing; automation package; coupling efficiency; elliptical mode field; endface polishing method; fiber microlens; high-power laser diode; mode field mismatch; online image inspection; quadrangular pyramid-shaped fiber endface; single-mode fibers; Automatic control; Automation; Diode lasers; Fabrication; Image analysis; Inspection; Lenses; Microoptics; Optical fiber communication; Shape control; Automation package; coupling efficiency; fiber microlens;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2006.875419
  • Filename
    1667881