DocumentCode :
1079249
Title :
Development of high-power electromagnetic (HPEM) standards
Author :
Wik, Manuel W. ; Radasky, William A.
Author_Institution :
Defence Materiel Adm., Sweden
Volume :
46
Issue :
3
fYear :
2004
Firstpage :
439
Lastpage :
445
Abstract :
The International Electrotechnical Commission (IEC) is the authority for world standards in electrical and electronics engineering. The IEC technical subcommittee 77C "High-power transient phenomena" of technical committee 77 "Electromagnetic compatibility" is preparing standards and technical reports on immunity to high-altitude electromagnetic pulse (HEMP) and currently to all categories of intentional electromagnetic interference (IEMI). A short description is given of the IEC main objective, management, and organization of technical work. An overview is given of the subcommittee 77C structure, management, objectives, and sources. At present, the work comprises 17 projects of which 14 have been published. The publications and projects are discussed under the following main parts: general, environment, testing and measurement techniques, installation and mitigation guidelines, and generic standards.
Keywords :
IEC standards; electromagnetic compatibility; electromagnetic interference; electromagnetic pulse; transients; IEC standard; International Electrotechnical Commission; electrical engineering; electromagnetic compatibility; electronics engineering; high-altitude electromagnetic pulse; high-power electromagnetic standard; high-power transient phenomena; intentional electromagnetic interference; EMP radiation effects; Electromagnetic compatibility; Electromagnetic compatibility and interference; Electromagnetic transients; Guidelines; IEC standards; Immunity testing; Measurement techniques; Standards development; Writing; Electromagnetic interference; measurement; pulse power systems; standardization; transient response;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2004.831895
Filename :
1325799
Link To Document :
بازگشت