DocumentCode
1079986
Title
Optimum doping profile of power MOSFET epitaxial layer
Author
Xing-bi Chen ; Hu, Chenming
Author_Institution
University of California, Berkeley, CA
Volume
29
Issue
6
fYear
1982
fDate
6/1/1982 12:00:00 AM
Firstpage
985
Lastpage
987
Abstract
The epitaxial layer resistance of a MOSFET can be slightly reduced by using an optimum doping profile, which exhibits a minimum in the upper half of the layer when the layer thickness is large compared to the cell-to-ceU spacing. A gradual transition from the n epitaxial layer to the n+ substrate is desirable. When current spreading is significant, the resistance may rise as VB 2rather than VB 2.5.
Keywords
Avalanche breakdown; Bipolar transistors; Current density; Doping profiles; Electron traps; Epitaxial layers; Laboratories; MOSFET circuits; Power MOSFET; Substrates;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1982.20818
Filename
1482315
Link To Document