DocumentCode
108046
Title
The rise of the monolithic 3-D chip [News]
Author
Courtland, Rachel
Volume
51
Issue
3
fYear
2014
fDate
Mar-14
Firstpage
18
Lastpage
19
Abstract
Ever since the integrated circuit made its debut, semiconductors have been "single-story" affairs. But chipmakers are now considering ways to build additional transistor-packed layers right on top of the first. The approach–dubbed monolithic, or sequential, fabrication–could boost the density, efficiency, and performance of logic chips without necessitating a move to smaller transistors. And that could be a boon for an industry that is seriously contemplating the end of miniaturization.
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/MSPEC.2014.6745869
Filename
6745869
Link To Document