• DocumentCode
    108046
  • Title

    The rise of the monolithic 3-D chip [News]

  • Author

    Courtland, Rachel

  • Volume
    51
  • Issue
    3
  • fYear
    2014
  • fDate
    Mar-14
  • Firstpage
    18
  • Lastpage
    19
  • Abstract
    Ever since the integrated circuit made its debut, semiconductors have been "single-story" affairs. But chipmakers are now considering ways to build additional transistor-packed layers right on top of the first. The approach–dubbed monolithic, or sequential, fabrication–could boost the density, efficiency, and performance of logic chips without necessitating a move to smaller transistors. And that could be a boon for an industry that is seriously contemplating the end of miniaturization.
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.2014.6745869
  • Filename
    6745869