Title :
AC and Impulse Dielectric Strength of Polymer Materials Under Tensile Stress at 77 K
Author :
Meng Song ; Kun Nan Cao ; Da Da Wang ; Xin Yang ; Bin Wei
Author_Institution :
Yunnan Power Grid Corp., Qilin, China
Abstract :
The performance of dielectric materials has an important effect on influencing the service life of the electric equipments. The dielectric sheets used for superconducting devices usually endure several lapping tension when lapped on the conductor, so the AC and impulse dielectric strengths of polymer sheets under tensile status are important to dielectric design. In this paper, a special electrode system was designed to measure the AC and impulse breakdown voltages of polyimide and poly tetra fluoro ethylene (PTFE) sheets under tensile status both in air at normal temperature and in liquid nitrogen at 77 K. The test data are processed by the method of Weibull plot. As a result, the AC dielectric strengths of polyimide sheets in liquid nitrogen at 77 K increase significantly as the tensile stresses increasing, the most amplitude achieves 29.16%. The impulse dielectric strengths of two polymer sheets all decrease little as the tensile stresses increasing. The AC and impulse dielectric strengths of polyimide under tensile stress are significantly higher than PTFE in liquid nitrogen at 77 K, Polyimide has good dielectric characteristics under tensile status in liquid nitrogen at 77 K.
Keywords :
dielectric materials; electric breakdown; electric strength; polymers; sheet materials; AC breakdown voltage; AC dielectric strength; PTFE; Weibull plot; dielectric design; dielectric sheets; electric equipments; electrode system; impulse breakdown voltage; impulse dielectric strength; lapping tension; liquid nitrogen; polyimide sheets; polymer sheets; polytetrafluoroethylene; service life; superconducting devices; temperature 77 K; tensile stress; Dielectric breakdown; Liquids; Nitrogen; Polyimides; Tensile stress; Dielectric strength; Weibull plot; liquid nitrogen environment; tensile status;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2014.2344760