DocumentCode :
1081409
Title :
Electrolytic models for metallic electromigration failure mechanisms
Author :
Krumbein, Simeon J.
Author_Institution :
AMP Inc., Harrisburg, PA, USA
Volume :
44
Issue :
4
fYear :
1995
fDate :
12/1/1995 12:00:00 AM
Firstpage :
539
Lastpage :
549
Abstract :
Metallic electromigration is the movement of metallic material across a nonmetallic medium, under the influence of an electric field. It is increasingly important in the performance and reliability of electronic systems as an underling cause of functional failures in electrical and electronic components. This tutorial discusses the characteristics of the various electromigration mechanisms, with primary emphasis on electrolytically-controlled processes that occur under low power and relatively ambient conditions
Keywords :
circuit reliability; electric fields; electrolysis; electromigration; failure analysis; reliability theory; characteristics; electric field; electrical components; electrolytic models; electronic components; electronic systems; failure mechanisms; metallic electromigration; performance; reliability; tutorial; Conducting materials; Conductors; Copper; Electromigration; Electronic components; Failure analysis; Inorganic materials; Scanning electron microscopy; Silver; Tutorial;
fLanguage :
English
Journal_Title :
Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9529
Type :
jour
DOI :
10.1109/24.475971
Filename :
475971
Link To Document :
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