DocumentCode
1082183
Title
A simple model for short-channel effects of a buried-channel MOSFET on the buried insulator
Author
Omura, Yasuhisa
Author_Institution
Nippon Telegraph and Telephone Public Corporation, Tokyo, Japan
Volume
29
Issue
11
fYear
1982
fDate
11/1/1982 12:00:00 AM
Firstpage
1749
Lastpage
1755
Abstract
A majority-carrier distribution model and a channel potential-profile model, in which the barrier-lowering effect is taken into account, are proposed for a buried-channel MOSFET (BC-MOSFET/ SOI). Simple expressions for threshold voltage and drain breakdown voltage were derived from the models for a short-channel BC-MOSFET/ SOI. The comparison between theory and experimental results shows reasonable agreement. The drain-bias coefficient γ of threshold voltage for BC-MOSFET´s/ SOI is approximately proportional to TND -1Leff -2, where T, ND , and Leff are the temperature, the doping concentration in the channel region, and the channel length, respectively. The coefficient γ depends slightly on the drain bias. BC-MOSFET´s/SOI are able to be more miniaturized than surface-channel MOSFET´s (SC-MOSFET´s) at the small power source voltage, and SC-MOSFET´s are able to be more miniaturized than BC-MOSFET´s/SOI at the large drain bias. It is shown that the conventional, simple scaling scheme, which holds the constant electric field, is not applicable to BC-MOSFET´s/SOI. The power source voltage has to be fixed when dimensions and doping concentrations are scaled down. On the other hand, only the channel region thickness has to be fixed when the power source voltage is scaled down.
Keywords
Doping; Electric breakdown; Insulation; MOSFET circuits; Neodymium; Semiconductor process modeling; Silicon on insulator technology; Temperature; Threshold voltage; Transconductance;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1982.21021
Filename
1482518
Link To Document