Title :
Impact of geometry on thermoelastic dissipation in micromechanical resonant beams
Author :
Candler, Rob N. ; Duwel, Amy ; Varghese, Mathew ; Chandorkar, Saurabh A. ; Hopcroft, Matthew A. ; Park, Woo-Tae ; Kim, Bongsang ; Yama, Gary ; Partridge, Aaron ; Lutz, Markus ; Kenny, Thomas W.
Author_Institution :
Dept. of Electr.& Mech. Eng, Stanford Univ., CA
Abstract :
Thermoelastic dissipation (TED) is analyzed for complex geometries of micromechanical resonators, demonstrating the impact of resonator design (i.e., slots machined into flexural beams) on TED-limited quality factor. Zener first described TED for simple beams in 1937. This work extends beyond simple beams into arbitrary geometries, verifying simulations that completely capture the coupled physics that occur. Novel geometries of slots engineered at specific locations within the flexural resonator beams are utilized. These slots drastically affect the thermal-mechanical coupling and have an impact on the quality factor, providing resonators with quality factors higher than those predicted by simple Zener theory. The ideal location for maximum impact of slots is determined to be in regions of high strain. We have demonstrated the ability to predict and control the quality factor of micromechanical resonators limited by thermoelastic dissipation. This enables tuning of the quality factor by structure design without the need to scale its size, thus allowing for enhanced design optimization
Keywords :
Q-factor; beams (structures); internal friction; micromechanical resonators; thermoelasticity; Zener theory; flexural resonator beams; geometry; micromechanical resonant beams; micromechanical resonators; quality factor; resonator design; thermal-mechanical coupling; thermoelastic dissipation; Capacitive sensors; Geometry; Micromechanical devices; Optical coupling; Physics; Q factor; Resonance; Solid modeling; Thermal factors; Thermoelasticity; Damping; energy dissipation; microelectromechanical systems (MEMS); micromechanical resonator; quality factor; thermoelastic dissipation;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2006.879374