DocumentCode :
1082329
Title :
Methanol steam reformer on a silicon wafer
Author :
Park, Hyung Gyu ; Malen, Jonathan A. ; Piggott, W. Thomas, III ; Morse, Jeffrey D. ; Greif, Ralph ; Grigoropoulos, Costas P. ; Havstad, Mark A. ; Upadhye, Ravi
Author_Institution :
Dept. of Mech. Eng., California Univ., Berkeley, CA
Volume :
15
Issue :
4
fYear :
2006
Firstpage :
976
Lastpage :
985
Abstract :
A study of the reforming rates, heat transfer and flow through a methanol reforming catalytic microreactor fabricated on a silicon wafer are presented. Packed bed microchannel reactors were fabricated using silicon DRIE, followed by wafer bonding. The reactor bed was subsequently filled with catalyst particles. Thermal control is achieved through on-chip resistive heaters, whereby methanol steam reforming reactions were studied over a temperature range from 180-300 degC. Three simulations of varying complexity, including three-dimensional (3-D), quasi-3-D, and 1-D models, were developed. Comparison of the models with experimental results shows good agreement over a range of operating conditions. We found that Amphlett´s kinetics for methanol reforming provided accurate results, and that for our operating conditions the reforming reaction could be modeled without mass transport considerations. The 1-D model provided a rapid analytical tool to assess the performance of the microreactor. Use of such computationally efficient design tools provides an effective means to analyze the performance of microreactor designs prior to fabrication and test. Hence, reformer geometry, catalyst loading, and operating parameters can be optimized to afford the desired hydrogen output and conversion. Concepts for insulating the reactor while maintaining small overall size are further analyzed
Keywords :
chemical reactors; fuel cells; heat transfer; micromechanical devices; sputter etching; wafer bonding; 180 to 300 C; Amphlett kinetics; deep reactive ion etching; heat transfer; methanol steam reformer; microchannel reactors; resistive heaters; thermal control; wafer bonding; Heat transfer; Inductors; Methanol; Microchannel; Performance analysis; Semiconductor device modeling; Silicon; Temperature control; Thermal resistance; Wafer bonding; Heat transfer; methanol reforming; microreactor;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2006.878888
Filename :
1668194
Link To Document :
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