Bidirectional optical subassembly with prealigned silicon microlens and laser diode

Author

Shimura, Daisuke ; Sekikawa, Ryo ; Kotani, Kyoko ; Uekawa, Masahiro ; Maeno, Yoshinori ; Aoyama, Katsumi ; Sasaki, Hironori ; Takamori, Takashi ; Masuko, Koichiro ; Nakaya, Susumu

Author_Institution

Oki Electr. Ind. Co. Ltd., Tokyo

Volume

18

Issue

16

fYear

2006

Firstpage

1738

Lastpage

1740

Abstract

We have succeeded in developing a low-cost bidirectional optical subassembly chip using a silicon microlens for fiber-to-the-home application. The main optical elements of the bidirectional function were automatically aligned and integrated on a silicon optical bench. The cost of subassembly was markedly lowered both by reducing the part number and simplifying the assembly process. The prototype bidirectional optical component was successfully fabricated on the basis of the proposed chip. A receiver minimum sensitivity of -28.5 dBm was experimentally demonstrated even at 75 degC

Keywords

elemental semiconductors; microlenses; optical communication equipment; optical fabrication; optical fibre subscriber loops; semiconductor lasers; silicon; 75 degC; Si; bidirectional optical subassembly; fiber-to-the-home; laser diode; silicon microlens; Assembly; Costs; Diode lasers; Integrated optics; Lenses; Microoptics; Optical receivers; Optical sensors; Prototypes; Silicon; Bidirectional optical subassembly (BOSA); integration; microlens; surface-mount technology;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2006.879949

Filename

1668206