Abstract :
A new type of X-ray laser could give hope to the semiconductor industry as it struggles to continue its march toward miniaturization. This next-generation chip-making tool was developed at the National Science Foundation´s Engineering Research Center for Extreme Ultraviolet Science and Technology, located at Colorado State University, in Fort Collins.The laser operates at wavelengths of 18.9 and 13.9 nanometers, the latter fine enough for extreme ultraviolet (EUV) lithography, which will be needed to manufacture the generation of chips that are to become available around 2011.
Keywords :
X-ray lithography; laser beam applications; ultraviolet lithography; ultraviolet sources; EUV lithography; X-ray laser; extreme ultraviolet lithography; light source; miniaturization; next-generation chip-making tool; semiconductor industry; wavelength 13.9 mm; wavelength 18.9 nm; Light sources; Lithography; Optical amplifiers; Optical pulse generation; Optical pulses; Plasma waves; Power lasers; Pulse amplifiers; Ultraviolet sources; X-ray lasers;
