DocumentCode :
1083130
Title :
Laser activated flow of phosphosilicate glass in integrated circuit devices
Author :
Delfino, M. ; Reifsteck, T.A.
Author_Institution :
Fairchild Camera and Instrument Corporation, Palo Alto, CA
Volume :
3
Issue :
5
fYear :
1982
fDate :
5/1/1982 12:00:00 AM
Firstpage :
116
Lastpage :
118
Abstract :
The use of a cw CO2laser to flow phosphosilicate glass for the planarization of p+/n diode arrays is demonstrated. A power density flow threshold of 110 kW cm-2at a wavelength of 9.26 µm is estimated and found to be essentially invariant to the thickness of the glass (1.0 to 1.5 µm) and to the phosphorus concentration of the glass (3 to 9% wt). This laser activated process results in glass flow without impurity diffusion in the active device area and is therefore compatible with VLSI.
Keywords :
Absorption; Annealing; Boron; Chemical lasers; Diodes; Furnaces; Glass; Implants; Semiconductor laser arrays; Wet etching;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1982.25504
Filename :
1482609
Link To Document :
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