DocumentCode :
1083300
Title :
Forward-bias stress effects on BJT gain and noise characteristics
Author :
Sun, C. Jack ; Grotjohn, T.A. ; Huang, C.-J. ; Reinhard, D.K. ; Yu, C.-C.W.
Author_Institution :
Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
Volume :
41
Issue :
5
fYear :
1994
fDate :
5/1/1994 12:00:00 AM
Firstpage :
787
Lastpage :
792
Abstract :
The effect of large current forward-bias stress on bipolar transistor gain and noise characteristics was investigated. The combination of high currents and high temperatures produced gain degradations or failures of transistors from three technologies. Similarly the application of high currents and high temperatures produced changes in transistor noise characteristics. Specifically, in all transistors stressed, the low-frequency noise initially decreased. It was also observed in two technologies that the noise eventually increased again as the stress continued. Electromigration induced stress is believed to play an important role in these phenomena. The third technology eventually showed failures of the transistors due to electromigration produced open circuits
Keywords :
bipolar transistors; electromigration; failure analysis; reliability; semiconductor device noise; BJT gain; LF noise; bipolar transistor; electromigration induced stress; electromigration produced open circuits; failures; forward-bias stress effects; gain degradations; high temperatures; large current forward-bias stress; low-frequency noise; noise characteristics; Circuits; Compressive stress; Current density; Degradation; Electromigration; Low-frequency noise; Noise level; Sun; Temperature; Testing;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.285032
Filename :
285032
Link To Document :
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