DocumentCode :
108398
Title :
Substrate-Integrated Waveguide Bandpass Filters With Planar Resonators for System-on-Package
Author :
Wei Shen ; Wen-Yan Yin ; Xiao-Wei Sun ; Lin-Sheng Wu
Author_Institution :
Center for Microwave & RF Technol., Shanghai Jiao Tong Univ., Shanghai, China
Volume :
3
Issue :
2
fYear :
2013
fDate :
Feb. 2013
Firstpage :
253
Lastpage :
261
Abstract :
This paper proposes some novel substrate-integrated waveguide (SIW) bandpass filters combined with planar resonators. According to specific topologies, microstrip lines with different electrical lengths are introduced into their designs. Their corresponding phase-shift characteristics are used to obtain the desired couplings between SIW cavities and the microstrip resonator. Two third-order filter samples are realized. One has a single transmission zero below the passband and the other possesses a quasi-elliptic response. Further, a fourth-order filter is developed by effectively superpositing two individual third-order topologies. It shows better frequency selectivity and flat in-band group delay, with good agreement between the measured and the simulated S-parameters. Their compactness and high rejection in the stopbands make them very suitable for system-on-package.
Keywords :
S-parameters; band-pass filters; microstrip lines; microstrip resonators; substrate integrated waveguides; system-on-package; S-parameters; SIW bandpass filters; SIW cavities; electrical lengths; flat in-band group delay; fourth-order filter; frequency selectivity; microstrip lines; microstrip resonator; phase-shift characteristics; planar resonators; quasielliptic response; substrate-integrated waveguide bandpass filters; system-on-package; third-order filter samples; third-order topologies; transmission zero; Cavity resonators; Couplings; Filtering theory; Microstrip resonators; Q factor; Resonant frequency; $S$-parameters; bandpass filter; dual-mode resonator; quasi-elliptic function; substrate-integrated waveguide; system on package; transmission zeros;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2224348
Filename :
6397590
Link To Document :
بازگشت