Title :
Characterization of recombination centers in Si epilayers after He implantation by direct measurement of local lifetime distribution with the AC lifetime profiling technique
Author :
Spirito, Paolo ; Daliento, Santolo ; Sanseverino, Annunziata ; Gialanella, Lucio ; Romano, Mario ; Limata, Benedicta N. ; Carta, Rossano ; Bellemo, Laura
Author_Institution :
Dipt. di Ingegneria Elettronica e delle Telecomunicazioni, Univ. of Napoli, Italy
Abstract :
The distribution of recombination centers induced in Si epi-substrates by helium (He) implantation is obtained for the first time by direct measurement of local recombination lifetime profile along the layer, using the ac differential lifetime profiling technique. The different energy levels of the recombination centers induced by He implantation at different doses and energies have been extracted, as a function of the position in the layer, by temperature scanning of the lifetime profiles. The lifetime measurements clearly demonstrate the presence of a secondary defect distribution that extend from the region of maximum primary damage both at lower and higher depths respect to the stopping range depth, due to the relatively large concentration of primary defects created near the stopping range, and give a coherent picture of the effects of He implant on the "local" lifetime.
Keywords :
carrier lifetime; defect states; electron-hole recombination; elemental semiconductors; helium; semiconductor epitaxial layers; AC lifetime profiling technique; He; He implantation; Si; Si epilayers; differential lifetime profiling technique; local lifetime distribution; power diode; primary defects; recombination centers characterization; recombination centers energy levels; secondary defect distribution; Diodes; Energy states; Helium; Implants; Industrial control; Lifetime estimation; Silicon; Spontaneous emission; Temperature; Time measurement; Helium irradiation; lifetime control; lifetime measurements; power diode; recombination centers;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2004.833374