DocumentCode :
1084738
Title :
A new method to extract EOT of ultrathin gate dielectric with high leakage current
Author :
Zhijiong Luo ; Ma, T.P.
Volume :
25
Issue :
9
fYear :
2004
Firstpage :
655
Lastpage :
657
Abstract :
The standard capacitance-voltage (C-V ) technique can no longer determine accurately the equivalent oxide thickness (EOT) for an advanced CMOS transistor with ultrathin gate dielectric where there is high gate leakage current, as well as series resistance; this situation will get worse as the CMOS transistor´s scaling trend continues. This paper describes a simple methodology based on dual-frequency C-V measurement and four-element circuit model to extract accurately the EOT in the presence of gate leakage current and series resistance. This method can be effective with a current density of 1000 A/cm2 for a 10 μm ×10 μm capacitor. Such a high current density will satisfy the projected gate leakage current requirements for many generations of CMOS technologies, as specified in the 2003 International Technology Roadmap for Semiconductors.
Keywords :
capacitance; current density; dielectric thin films; electric resistance; leakage currents; semiconductor device models; 2003 International Technology Roadmap for Semiconductors; CMOS transistor; EOT extraction; MIS capacitance; capacitance-voltage technique; current density; dual-frequency C-V measurement; equivalent circuit model; equivalent oxide thickness; four-element circuit model; gate leakage current; series resistance; ultrathin gate dielectric; CMOS technology; Capacitance-voltage characteristics; Circuits; Current density; Current measurement; Dielectric measurements; Electrical resistance measurement; Leakage current; Semiconductor device modeling; Transistors;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2004.834634
Filename :
1327725
Link To Document :
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