DocumentCode
1084818
Title
Algorithmic Approach for Thermal Port Definition
Author
Celo, Dritan ; Walkey, David J. ; Smy, Tom
Author_Institution
Carleton Univ., Ottawa
Volume
30
Issue
3
fYear
2007
Firstpage
491
Lastpage
498
Abstract
An algorithmic technique is presented that allows estimation of maximum temperature rise in a thermal model with component-board thermal interaction. The technique is based on a generalized thermal port grouping to estimate the interface temperature profile derived from coarse port assignments. By using a very simple environment, it takes a library-type thermal component model with many thermal ports included and transforms it by grouping thermal ports based on a temperature profile, allowing a minimal number of port groups to provide the same accuracy as the original model in a shorter time. The usefulness of this technique is illustrated through simulation of two thermal models with extreme nonuniform temperature distribution on the interface surface. The prediction accuracy is evaluated by comparison with the final solutions to numerical simulation.
Keywords
temperature distribution; thermal management (packaging); algorithmic technique; component-board thermal interaction; interface temperature profile; library-type thermal component model; temperature distribution; thermal port grouping; Accuracy; Assembly; Councils; Electronics packaging; Geometry; Microelectronics; Numerical simulation; Solid modeling; Sparse matrices; Temperature distribution; Thermal connection; thermal modeling; thermal ports;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2007.898627
Filename
4285923
Link To Document