• DocumentCode
    1084818
  • Title

    Algorithmic Approach for Thermal Port Definition

  • Author

    Celo, Dritan ; Walkey, David J. ; Smy, Tom

  • Author_Institution
    Carleton Univ., Ottawa
  • Volume
    30
  • Issue
    3
  • fYear
    2007
  • Firstpage
    491
  • Lastpage
    498
  • Abstract
    An algorithmic technique is presented that allows estimation of maximum temperature rise in a thermal model with component-board thermal interaction. The technique is based on a generalized thermal port grouping to estimate the interface temperature profile derived from coarse port assignments. By using a very simple environment, it takes a library-type thermal component model with many thermal ports included and transforms it by grouping thermal ports based on a temperature profile, allowing a minimal number of port groups to provide the same accuracy as the original model in a shorter time. The usefulness of this technique is illustrated through simulation of two thermal models with extreme nonuniform temperature distribution on the interface surface. The prediction accuracy is evaluated by comparison with the final solutions to numerical simulation.
  • Keywords
    temperature distribution; thermal management (packaging); algorithmic technique; component-board thermal interaction; interface temperature profile; library-type thermal component model; temperature distribution; thermal port grouping; Accuracy; Assembly; Councils; Electronics packaging; Geometry; Microelectronics; Numerical simulation; Solid modeling; Sparse matrices; Temperature distribution; Thermal connection; thermal modeling; thermal ports;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2007.898627
  • Filename
    4285923