DocumentCode
1084850
Title
A Fully Embedded LTCC Multilayer BPF for 3-D Integration of 40-GHz Radio
Author
Cho, Yun Hee ; Jung, Dong Yun ; Lee, Young Chul ; Lee, Jae W. ; Song, Myung Sun ; Nam, Eun-Soo ; Kang, Sukhoon ; Park, Chul Soon
Author_Institution
Samsung Elecro-Mech., Suwon
Volume
30
Issue
3
fYear
2007
Firstpage
521
Lastpage
525
Abstract
This paper demonstrates a low loss fully embedded multilayer bandpass filter (BPF) using low-temperature cofired ceramic (LTCC) technology for 3-D integration of 40-GHz multimedia wireless system (MWS) radio. The LTCC filter implemented in a stripline configuration occupies an area of only 5.5 times 2.3 times 0.6 mm including shielding structure and coplanar waveguide (CPW) transitions. The measured insertion loss was as small as 1.9 dB at a center frequency of 41.8 GHz, and the return loss was 12.2 dB including the loss associated with two CPW-to-stripline transitions. This six-layer BPF showed 3-dB bandwidth of 10.5% from 39.6 to 44.0 GHz at a center frequency of 41.8 GHz and suppressed the local oscillator (LO) signal to 20.2 dB at a local oscillator frequency of 38.8 GHz, making it suitable for the 40 GHz MWS applications.
Keywords
band-pass filters; ceramic packaging; coplanar waveguide components; millimetre wave filters; multimedia communication; strip line filters; strip line transitions; 3-D integration; CPW-to-stripline transitions; LTCC multilayer BPF; coplanar waveguide; frequency 39.6 GHz to 44 GHz; fully embedded multilayer bandpass filter; insertion loss; local oscillator; loss 1.9 dB; loss 12.2 dB; low-temperature cofired ceramics; millimeter-wave system; multimedia wireless system radio; return loss; shielding structure; stripline configuration; Band pass filters; Ceramics; Coplanar waveguides; Frequency measurement; Local oscillators; Loss measurement; Multimedia systems; Nonhomogeneous media; Stripline; Waveguide transitions; Bandpass filter (BPF); embedded; low-temperature cofired ceramics (LTCC); multilayer; multimedia wireless systems (MWS);
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2007.898587
Filename
4285926
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