• DocumentCode
    1084907
  • Title

    Foreword Wafer-Level Packaging

  • Author

    van Driel, Willem Dirk

  • Volume
    30
  • Issue
    3
  • fYear
    2007
  • Firstpage
    358
  • Lastpage
    358
  • Abstract
    The four papers in this special section focus on wafer-level packaging. The selected papers cover the state-of-the-art and future development trends for wafer level chip scale packages (WLCSPs) by the leading institutes and industries operating in this field.
  • Keywords
    Books; Chip scale packaging; Costs; Electronic components; Electronics packaging; Flip chip; Manufacturing; Microelectronics; Surface-mount technology; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2007.905221
  • Filename
    4285932
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1084907