Title :
Foreword Wafer-Level Packaging
Author :
van Driel, Willem Dirk
Abstract :
The four papers in this special section focus on wafer-level packaging. The selected papers cover the state-of-the-art and future development trends for wafer level chip scale packages (WLCSPs) by the leading institutes and industries operating in this field.
Keywords :
Books; Chip scale packaging; Costs; Electronic components; Electronics packaging; Flip chip; Manufacturing; Microelectronics; Surface-mount technology; Wafer scale integration;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2007.905221
