Title :
Characterization of Co-Planar Silicon Transmission Lines With and Without Slow-Wave Effect
Author :
Kim, Woopoung ; Swaminathan, Madhavan
Author_Institution :
Rambus Inc., Los Altos
Abstract :
Co-planar lines on silicon substrates with and without slow-wave effect are characterized using time-domain reflectometry (TDR) and vector network analyzer (VNA) measurements, and simulated using a proposed nonphysical resistance-inductance-conductance-capacitance (RLGC) model. The silicon co-planar lines are characterized based on comparison to package transmission lines. Co-planar silicon lines without slow-wave mode are modeled in the same way as package transmission lines, but co-planar lines with slow-wave mode are modeled in a different way from package transmission lines. Hence, a nonphysical RLGC model including slow-wave mode is proposed along with the extraction method from VNA measurements. Simulation results correlate well with time- and frequency-domain measurements for the co-planar silicon lines.
Keywords :
coplanar transmission lines; integrated circuit packaging; microwave integrated circuits; monolithic integrated circuits; network analysers; silicon; slow wave structures; time-domain reflectometry; co-planar silicon transmission lines; frequency-domain measurement; nonphysical resistance-inductance-conductance-capacitance model; package transmission lines; slow-wave effect; time-domain measurement; time-domain reflectometry; vector network analyzer; Conductivity; Coplanar transmission lines; Delay; Frequency; Packaging; Power transmission lines; Silicon; Time domain analysis; Transmission line measurements; Transmission lines; Co-planar line; TDR; VNA; silicon transmission line; slow- wave;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2007.898623