DocumentCode :
1085001
Title :
Fundamental Building Blocks for Circuits on Textiles
Author :
Locher, Ivo ; Tröster, Gerhard
Author_Institution :
ETH Zurich, Zurich
Volume :
30
Issue :
3
fYear :
2007
Firstpage :
541
Lastpage :
550
Abstract :
This paper presents the necessary ingredients for a successful realization of electrical circuits on fabrics. We start with the specification of a hybrid fabric as substrate. The discussion of textile transmission lines as well as textile interconnects reveals a flat frequency response up to about 2 GHz and 600 MHz, respectively. The proposed transmission lines feature line impedances in the range of 250 Omega. A novel interposer concept is the key technology to our approach of implementing circuits on textiles. We introduce different variants of this interposer and give formulas to determine their fabric area consumption. The presented technologies allow realization and wiring of circuits on fabrics with signal frequencies up to several hundred megahertz.
Keywords :
fabrics; intelligent materials; textile products; wearable computers; electrical circuits; fabric area consumption; hybrid fabric; interposer technology; line impedances; system-on-textile; textile interconnects; textile transmission lines; wearable computing; Clothing; Copper; Distributed parameter circuits; Fabrics; Integrated circuit interconnections; Textile technology; Transmission line measurements; Wearable computers; Wire; Yarn; Interposer technology; system-on-textile; textile interconnects; textile substrates; wearable computing;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2007.898636
Filename :
4285941
Link To Document :
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