DocumentCode :
1085026
Title :
RICE: rapid interconnect circuit evaluation using AWE
Author :
Ratzlaff, Curtis L. ; Pillage, Lawrence T.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Volume :
13
Issue :
6
fYear :
1994
fDate :
6/1/1994 12:00:00 AM
Firstpage :
763
Lastpage :
776
Abstract :
This paper describes the Rapid Interconnect Circuit Evaluator (RICE) software developed specifically to analyze RC and RLC interconnect circuit models of virtually any size and complexity. RICE focuses specifically on the passive interconnect problem by applying the moment-matching technique of Asymptotic Waveform Evaluation (AWE) and application-specific circuit analysis techniques to yield large gains in run-time efficiency over circuit simulation without sacrificing accuracy. Moreover, this focus of AWE on passive interconnect problems permits the use of moment-matching techniques that produce stable, pre-characterized, reduced-order models for RC and RLC interconnects. RICE is demonstrated to be as accurate as a transient circuit simulation with hundreds or thousands of times the efficiency. The use of RICE is demonstrated on several VLSI interconnect and off-chip microstrip models
Keywords :
VLSI; circuit analysis computing; delays; digital integrated circuits; distributed parameter networks; equivalent circuits; linear network analysis; monolithic integrated circuits; AWE; RC interconnect circuit models; RICE; RLC interconnect circuit models; VLSI interconnect models; application-specific circuit analysis; asymptotic waveform evaluation; circuit simulation; moment-matching technique; offchip microstrip models; passive interconnect problem; rapid interconnect circuit evaluation; reduced-order models; software; Circuit analysis; Circuit simulation; Delay effects; Integrated circuit interconnections; Microstrip; RLC circuits; Reduced order systems; Runtime; Timing; Very large scale integration;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.285250
Filename :
285250
Link To Document :
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