Title :
Application of planar lightwave circuit platform to hybrid integrated optical WDM transmitter/receiver module
Author :
Yamada, Y. ; Suzuki, S. ; Moriwaki, K. ; Hibino, Y. ; Tohmori, Y. ; Akutsu, Y. ; Nakasuga, Y. ; Hashimoto, T. ; Terui, H. ; Yanagisawa, M. ; Inoue, Y. ; Akahori, Y. ; Nagase, R.
Author_Institution :
NTT Opto-Electron. Labs., Ibaraki, Japan
fDate :
8/3/1995 12:00:00 AM
Abstract :
The authors have fabricated an optical WDM module with a simple configuration using a PLC platform together with a spot-size converted LD (SS-LD) and a waveguide PD (WG-PD). Since the module can be formed simply by flip-chip bonding of the SS-LD and the WG-PD, this configuration reduces the number of components, and thus helps achieve a cost reduction
Keywords :
flip-chip devices; hybrid integrated circuits; integrated optoelectronics; optical receivers; optical transmitters; wavelength division multiplexing; PLC platform; WDM transmitter/receiver module; cost reduction; flip-chip bonding; hybrid integrated optical module; planar lightwave circuit platform; spot-size converted LD; waveguide PD;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19950938
