DocumentCode
1085030
Title
Application of planar lightwave circuit platform to hybrid integrated optical WDM transmitter/receiver module
Author
Yamada, Y. ; Suzuki, S. ; Moriwaki, K. ; Hibino, Y. ; Tohmori, Y. ; Akutsu, Y. ; Nakasuga, Y. ; Hashimoto, T. ; Terui, H. ; Yanagisawa, M. ; Inoue, Y. ; Akahori, Y. ; Nagase, R.
Author_Institution
NTT Opto-Electron. Labs., Ibaraki, Japan
Volume
31
Issue
16
fYear
1995
fDate
8/3/1995 12:00:00 AM
Firstpage
1366
Lastpage
1367
Abstract
The authors have fabricated an optical WDM module with a simple configuration using a PLC platform together with a spot-size converted LD (SS-LD) and a waveguide PD (WG-PD). Since the module can be formed simply by flip-chip bonding of the SS-LD and the WG-PD, this configuration reduces the number of components, and thus helps achieve a cost reduction
Keywords
flip-chip devices; hybrid integrated circuits; integrated optoelectronics; optical receivers; optical transmitters; wavelength division multiplexing; PLC platform; WDM transmitter/receiver module; cost reduction; flip-chip bonding; hybrid integrated optical module; planar lightwave circuit platform; spot-size converted LD; waveguide PD;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19950938
Filename
408329
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