Title :
Multichip Integration on a PLC Platform for 16 × 16 Optical Switch Module Using Passive Alignment Technique
Author :
Rho, Byung Sup ; Lim, Jung Woon
Author_Institution :
Korea Photonics Technol. Inst., Gwangju
Abstract :
We have integrated eight sets of four-channel semiconductor optical amplifier (SOA) array chips on a silica-based planar lightwave circuit (PLC) platform for 16 times 16 optical switch module by flip-chip bonding technique. To accurately bond eight sets of the arrayed SOA chips on a PLC platform, two methods of two-step assembly and one-step assembly were tried. Among the results of two assembly methods, one-step assembly was estimated to be desirable in respect of the horizontal and vertical bonding accuracy. The bonding accuracy was measured to be within 0.5 mum. Also, we demonstrated 16 times 16 optical switch module.
Keywords :
bonding processes; flip-chip devices; integrated optics; multichip modules; optical arrays; optical switches; semiconductor optical amplifiers; 16times16 optical switch module; PLC platform; SOA array chips; flip-chip bonding technique; four-channel semiconductor optical amplifier array chips; horizontal bonding; multichip integration; one-step assembly; passive alignment technique; silica-based planar lightwave circuit; vertical bonding; Assembly; Bonding; Optical crosstalk; Optical devices; Optical signal processing; Optical switches; Programmable control; Semiconductor optical amplifiers; Stimulated emission; Telecommunication switching; Flip-chip bonding; optical switch; planar lightwave circuit (PLC); semiconductor optical amplifier (SOA);
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2006.890212
