Title :
Preparation of Fine Copper Powder With Chemical Reduction Method and Its Application in MLCC
Author :
Wu, Songping ; Ding, Xiaohong
Author_Institution :
South China Univ. of Technol., Guangzhou
Abstract :
In this paper, the preparation of fine copper powder with chemical reduction method was investigated. Polyhedron nonagglomerated monodispersed copper powders by the reaction of CuSO4ldr5H2O and ascorbic acid were synthesized at pH 6~7 and reaction temperature of 60degC~70degC. It was also found by X-ray diffraction (XRD) analysis that a mixture of copper and cuprous oxide could be obtained when [Cu(NH3)4]2+ was reduced by ascorbic acid. Reaction temperature and pH have great effects on efficiency and particle size of copper powders. Copper powders were applied as terminal electrode materials of base metal electrode-multilayer ceramic capacitor (BME-MLCC), and the microstructures, including cross section and interface, of copper thick film were discussed with scanning electron microscopy. The results indicated that copper thick film has a loose, porous cross section and a rough interface. The adhesion strength of copper electrode is high due to rough microstructure caused by interfacial reaction.
Keywords :
X-ray diffraction; adhesion; ceramic capacitors; copper; disperse systems; electrodes; materials preparation; pH; particle size; powder technology; reduction (chemical); scanning electron microscopy; thick film capacitors; Cu; CuSO4H2O; MLCC application; X-ray diffraction analysis; XRD; [Cu(NH3)4]2+; adhesion strength; ascorbic acid; base metal electrode-multilayer ceramic capacitor; chemical reduction method; copper film interface; copper thick film cross section; copper thick film microstructures; fine copper powder preparation; interfacial reaction; particle size; polyhedron nonagglomerated monodispersed copper powders; reaction temperature; rough microstructure; scanning electron microscopy; terminal electrode materials; Chemicals; Copper; Electrodes; Inorganic materials; Microstructure; Powders; Temperature; Thick films; X-ray diffraction; X-ray scattering; Ascorbic acid; chemical reduction; multilayer ceramic capacitor (MLCC); ultrafine copper powders;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2007.898512
