DocumentCode :
1085391
Title :
Erbium-doped fiber splicing and splice loss estimation
Author :
Zheng, Wenxin ; Hultén, Ola ; Rylander, Robert
Author_Institution :
Div. of Fiber Opt., Ericsson Bus. Networks AB, Sundbyberg, Sweden
Volume :
12
Issue :
3
fYear :
1994
fDate :
3/1/1994 12:00:00 AM
Firstpage :
430
Lastpage :
435
Abstract :
Erbium-doped fibers, deployed in erbium-doped fiber amplifiers (EDFA), often have small mode diameters (about 4-6 μm). If these fibers were to be abruptly interfaced with larger mode field diameter (7.5-10.5 μm) dispersion-shifted or conventional fibers, unacceptably large transmission loss penalties would be incurred. However, since the diffusion speed of most erbium fiber designs is higher than other fibers, a special real-time control (RTC) splicing technique is developed based on an image processing and a synamic splice loss estimation procedure in order to assure optimum thermal diffusion of the fiber core dopants, thereby creating a tapered transition region between the mating fibers, resulting in fiber splices that have consistently low losses (<0.1 dB) and high strength (>200 kpsi)
Keywords :
erbium; fibre lasers; optical couplers; optical dispersion; optical fibre fabrication; optical fibres; optical losses; 4 to 6 mum; 7.5 to 10.5 mum; EDFA; Er-doped fiber amplifiers; Er-doped fiber splicing; abruptly interfaced; conventional fibers; diffusion speed; dispersion-shifted; erbium fiber designs; fiber core dopants; fiber splices; high strength; image processing; larger mode field diameter; low losses; mating fibers; optimum thermal diffusion; real-time control splicing technique; small mode diameters; splice loss estimation; synamic splice loss estimation procedure; tapered transition region; unacceptably large transmission loss penalties; Erbium; Erbium-doped fiber amplifier; Optical fiber dispersion; Optical fiber polarization; Optical fibers; Optical losses; Optical materials; Power amplifiers; Silicon compounds; Splicing;
fLanguage :
English
Journal_Title :
Lightwave Technology, Journal of
Publisher :
ieee
ISSN :
0733-8724
Type :
jour
DOI :
10.1109/50.285325
Filename :
285325
Link To Document :
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