DocumentCode
1085456
Title
Mathematical model of a plated-through hole under a load induced by thermal mismatch
Author
Mirman, Boris A.
Author_Institution
Digital Equipment Corp., Andover, MA, USA
Volume
11
Issue
4
fYear
1988
fDate
12/1/1988 12:00:00 AM
Firstpage
506
Lastpage
511
Abstract
A mathematical model simulating a plated-through hole (PTH) under a thermal load is proposed to predict PTH reliability. The PTH is treated as a system of disks joined to a barrel. Under the load, the disks bend and the barrel undergoes either tension or compression. The resulting failures are predicted by computing failure indicators. Also presented are simple formulas to estimate some of these failure indicators
Keywords
circuit reliability; failure analysis; printed circuits; PTH reliability; failure indicators; failures; mathematical model; plated-through hole; thermal load; thermal mismatch; Failure analysis; Information analysis; Material properties; Materials testing; Mathematical model; Microstructure; Predictive models; Resins; Stress; Thermal loading;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.16690
Filename
16690
Link To Document