Statistical analysis of power module thermal test equipment performance

Describe a test methodology for obtaining reliable thermal performance measurements for custom design of moderately-high-power semiconductor modules. The accuracy and repeatability of the instrument system was determined by use of a statistical gauge study. It is shown that the statistical tool is essential in determining the ability of the measurement system to detect and quantify variability in the data due to the parts under test, the test equipment, and operator influences. The proposed method provides a means of demonstrating vendor/supplier test capability which can reduce potential sources of conflict in part acceptance testing.<>