Title :
Effect of plasma poly etch on effective channel length and hot carrier reliability in submicron transistors
Author :
Li, Xiaoyu ; Divakaruni, R. ; Hsu, Jen-Tai ; Prabhakar, V. ; Aum, Paul ; Chan, David ; Viswanathan, C.R.
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
fDate :
4/1/1994 12:00:00 AM
Abstract :
The effective channel length (L/sub eff/)) variation resulting from exposure to the plasma during the poly-etch step was investigated. The plasma induced charging effect was also studied using gate polysilicon antenna structures. It was found that, due to the poly etching, the L/sub eff/ variation has a larger impact on the fully processed transistor transconductance characteristics than the charging effect in the gate oxide region. It is believed that the damage in the LDD region, which gives rise to the L/sub eff/ variation, imposes a serious hot carrier reliability problem.<>
Keywords :
hot carriers; insulated gate field effect transistors; reliability; semiconductor device testing; sputter etching; LDD region; MOSFETs; effective channel length; gate polysilicon antenna structures; hot carrier reliability; plasma induced charging effect; plasma poly etch; submicron transistors; transistor transconductance characteristics; Antenna measurements; Etching; Hot carriers; MOSFETs; Plasma applications; Plasma devices; Plasma properties; Plasma temperature; Stress; Transconductance;
Journal_Title :
Electron Device Letters, IEEE