DocumentCode :
1086014
Title :
Effect of plasma poly etch on effective channel length and hot carrier reliability in submicron transistors
Author :
Li, Xiaoyu ; Divakaruni, R. ; Hsu, Jen-Tai ; Prabhakar, V. ; Aum, Paul ; Chan, David ; Viswanathan, C.R.
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Volume :
15
Issue :
4
fYear :
1994
fDate :
4/1/1994 12:00:00 AM
Firstpage :
140
Lastpage :
141
Abstract :
The effective channel length (L/sub eff/)) variation resulting from exposure to the plasma during the poly-etch step was investigated. The plasma induced charging effect was also studied using gate polysilicon antenna structures. It was found that, due to the poly etching, the L/sub eff/ variation has a larger impact on the fully processed transistor transconductance characteristics than the charging effect in the gate oxide region. It is believed that the damage in the LDD region, which gives rise to the L/sub eff/ variation, imposes a serious hot carrier reliability problem.<>
Keywords :
hot carriers; insulated gate field effect transistors; reliability; semiconductor device testing; sputter etching; LDD region; MOSFETs; effective channel length; gate polysilicon antenna structures; hot carrier reliability; plasma induced charging effect; plasma poly etch; submicron transistors; transistor transconductance characteristics; Antenna measurements; Etching; Hot carriers; MOSFETs; Plasma applications; Plasma devices; Plasma properties; Plasma temperature; Stress; Transconductance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.285403
Filename :
285403
Link To Document :
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