DocumentCode :
1087059
Title :
Effect of silicide process on bipolar transistor current gain
Author :
Oh, K.H. ; Panousis, P.T.
Author_Institution :
Bell Laboratories, Allentown, PA
Volume :
30
Issue :
10
fYear :
1983
fDate :
10/1/1983 12:00:00 AM
Firstpage :
1406
Lastpage :
1408
Abstract :
Emitter Gummel number of modern bipolar transistors is an important factor in determining device performance, especially for heavily doped, shallow junction transistors. Removal of even small amounts of the active dopant from the shallow emitter, e.g., Ar sputteretch and PtSi formation, can significantly reduce the current gain of bipolar transistors. A simple theory of bipolar transistor gain shows that degradation of current gain is due to the reduction of emitter Gummel number. Emphasis is placed on the control of the Ar sputteretch and PtSi formation to obtain desired current gain and to determine its implication in the development of advanced bipolar transistors with very shallow emitter junctions.
Keywords :
Bipolar transistors; Broadband amplifiers; Cutoff frequency; Diodes; Microwave theory and techniques; Millimeter wave technology; Millimeter wave transistors; Notice of Violation; Silicides; Wideband;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1983.21310
Filename :
1483211
Link To Document :
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