Title :
Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples
Author :
Herkommer, D. ; Punch, Jeff ; Reid, M.
Author_Institution :
Stokes Inst., Univ. of Limerick, Limerick, Ireland
Abstract :
In this paper, the creep behavior of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 (SAC305) solder alloy is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs are conducted on joint-scale solder samples under shear. Stress-strain data is reported for constant stress (15-30 MPa) and constant shear strain rate (1E-6-1E-2 s-1) tests at temperatures of 20°C, 50 °C, 75°C, and 100°C. The quantitative data gained from the tests is used to fit an Anand viscoplastic constitutive model. The quality of the model fit and the intrinsic variability of the test specimens are also assessed.
Keywords :
copper alloys; creep; creep testing; silver alloys; solders; stress-strain relations; tin alloys; viscoplasticity; Anand viscoplastic constitutive model; Sn96.5Ag3.0Cu0.5; constant shear strain rate test; constant stress test; constitutive modeling; creep behavior; creep tests; joint-scale SAC305 solder shear samples; joint-scale solder samples; lead-free hypo-eutectic SAC305 solder alloy; strain rate-temperature pair; stress-strain data; stress-temperature pair; temperature 100 degC; temperature 20 degC; temperature 50 degC; temperature 75 degC; Creep; Data models; Metals; Strain; Stress; Testing; Constitutive modeling; Sn96.5Ag3.0Cu0.5 (SAC305); joint-scale; lead-free solder; shear test data;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2012.2227481
