Title :
The design, fabrication, and testing of corrugated silicon nitride diaphragms
Author :
Scheeper, Patrick R. ; Olthuis, Wouter ; Bergveld, Piet
Author_Institution :
MESA Res. Inst., Twente Univ., Enschede, Netherlands
fDate :
3/1/1994 12:00:00 AM
Abstract :
Silicon nitride corrugated diaphragms of 2 mm×2 mm×1 μm have been fabricated with 8 circular corrugations, having depths of 4, 10, or 14 μm. The diaphragms with 4-μm-deep corrugations show a measured mechanical sensitivity (increase in the deflection over the increase in the applied pressure) which is 25 times larger than the mechanical sensitivity of flat diaphragms of equal size and thickness. Since this gain in sensitivity is due to reduction of the initial stress, the sensitivity can only increase in the case of diaphragms with initial stress. A simple analytical model has been proposed that takes the influence of initial tensile stress into account. The model predicts that the presence of corrugations increases the sensitivity of the diaphragms, because the initial diaphragm stress is reduced. The model also predicts that for corrugations with a larger depth the sensitivity decreases, because the bending stiffness of the corrugations then becomes dominant. These predictions have been confirmed by experiments. The application of corrugated diaphragms offers the possibility to control the sensitivity of thin diaphragms by geometrical parameters, thus eliminating the effect of variations in the initial stress, due to variations in the diaphragm deposition process and/or the influence of temperature changes and packaging stress
Keywords :
diaphragms; microphones; plasma CVD; semiconductor device testing; semiconductor growth; silicon compounds; 1 mum; 10 mum; 14 mum; 2 mm; 4 mum; 4-μm-deep corrugations; LPCVD wafer fabrication; Si3N4; applied pressure; bending stiffness; circular corrugations; condenser microphone diaphragms; corrugated diaphragms; corrugated silicon nitride diaphragm; deflection; flat diaphragms; geometrical parameters; initial diaphragm stress; initial stress; initial tensile stress; mechanical sensitivity; packaging stress; temperature changes; thin diaphragms; Analytical models; Fabrication; Mechanical variables measurement; Predictive models; Pressure measurement; Silicon; Size measurement; Tensile stress; Testing; Thickness measurement;
Journal_Title :
Microelectromechanical Systems, Journal of