Title :
The cutting and polishing of electrooptic materials
Author_Institution :
United Technologies Res. Center, East Hartford, CT, USA
fDate :
4/1/1981 12:00:00 AM
Keywords :
Book reviews; Electrooptic materials/devices; Materials processing; Semiconductor device fabrication; Semiconductor materials; Acoustic measurements; Books; Lapping; Optical materials; Optical surface waves; Semiconductor materials; Surface acoustic waves; Surface emitting lasers; Surface finishing; Velocity measurement;
Journal_Title :
Quantum Electronics, IEEE Journal of
DOI :
10.1109/JQE.1981.1071147
