Title :
Differential scanning calorimetry studies on eutectic (Sn63/Pb37) solder paste and powder for surface mount technology
Author :
Tang, A.C.T. ; Sargent, P.M.
Author_Institution :
Dept. of Eng., Cambridge Univ., UK
Abstract :
The properties of eutectic solder paste (Sn63/Pb37) in an RMA flux and solder powder have been investigated using differential scanning calorimetry. The results show that the melting point for both the paste and powder samples occurs at 182 degrees C and also the effects of supercooling occurs for both the paste and the powder samples. The supercooling results are of vital importance in the modelling of the thermal processes for electronics manufacture using surface mount technology.
Keywords :
calorimetry; lead alloys; soldering; supercooling; surface mount technology; tin alloys; 182 degC; RMA flux; SnPb; differential scanning calorimetry; electronics manufacture; melting point; solder paste; solder powder; supercooling; surface mount technology;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19911250
