DocumentCode
1089538
Title
Simulation of the Thermal Process of Anode in Drawn Vacuum Arc
Author
Shi, Zongqian ; Jia, Shenli ; Dong, Hong ; Wang, Lijun
Author_Institution
Xi´´an Jiaotong Univ., Xi´´an
Volume
35
Issue
4
fYear
2007
Firstpage
920
Lastpage
924
Abstract
In this paper, a transient 2-D finite-element model was developed to simulate the anode activities of drawn vacuum arc. Some important thermal processes of anode, e.g., the temperature distribution, melt, and evaporation, have been investigated for copper vacuum arc of 27.5 kA (rms) with different separation current. The dimension of eroded region on anode due to melt and evaporation was simulated and compared with other experiments.
Keywords
anodes; copper; evaporation; melting; temperature distribution; thermal properties; vacuum arcs; Cu - Element; anode activity; copper vacuum arc; current 27.5 kA; drawn vacuum arc; eroded region; evaporation; melt; temperature distribution; thermal processes; transient 2D finite-element model; Anodes; Boundary conditions; Bridge circuits; Copper; Electrodes; Finite element methods; Iron; Plasma materials processing; Plasma temperature; Vacuum arcs; Anode; simulation; thermal process; vacuum arc;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/TPS.2007.896911
Filename
4287082
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