Fabrication of submicrometer gold lines using optical lithography and high-growth-rate electroplating

This letter presents a process for fabricating submicrometer gold lines with high aspect ratio and vertical sidewalls using high-growth-rate (133-nm/min) electroplating. A two-resist-layer system, photolithography, angled evaporation, and dry etching techniques are used to fabricate the electroplating mask. Lines less than 0.2 µm wide, with aspect ratios greater than 5, are obtained with the use of this technique.