• DocumentCode
    1090055
  • Title

    Use of Au/Te/Ni films for ohmic contact to GaAs

  • Author

    Ghosh, C. ; Yenigalla, P. ; Atkins, K.

  • Author_Institution
    ITT Gallium Arsenide Technology Center, Roanoke, VA
  • Volume
    4
  • Issue
    9
  • fYear
    1983
  • Firstpage
    301
  • Lastpage
    302
  • Abstract
    Ohmic contacts to n-type GaAs are usually fabricated by alloying AuGe/Ni films on GaAs. Ge acts as a donor to GaAs for fabrication of the ohmic contact. In an attempt to replace Ge, which is an amphoteric impurity, with a group VI element to improve on the ohmic contact resistivity, experiments were done with AuTe and AuTe/Ni contacts. A very low resistivity of ∼5 × 10-7Ω.cm2was obtained by alloying 1700 Å of AuTe film with 300 Å of nickel on top at 510°C. This is the lowest contact resistivity obtained with any material other than AuGe/Ni on n-type GaAs.
  • Keywords
    Alloying; Conductivity; Fabrication; Gallium arsenide; Gold; Impurities; Nickel; Ohmic contacts; Tellurium; Temperature;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1983.25741
  • Filename
    1483485