DocumentCode
1090055
Title
Use of Au/Te/Ni films for ohmic contact to GaAs
Author
Ghosh, C. ; Yenigalla, P. ; Atkins, K.
Author_Institution
ITT Gallium Arsenide Technology Center, Roanoke, VA
Volume
4
Issue
9
fYear
1983
Firstpage
301
Lastpage
302
Abstract
Ohmic contacts to n-type GaAs are usually fabricated by alloying AuGe/Ni films on GaAs. Ge acts as a donor to GaAs for fabrication of the ohmic contact. In an attempt to replace Ge, which is an amphoteric impurity, with a group VI element to improve on the ohmic contact resistivity, experiments were done with AuTe and AuTe/Ni contacts. A very low resistivity of ∼5 × 10-7Ω.cm2was obtained by alloying 1700 Å of AuTe film with 300 Å of nickel on top at 510°C. This is the lowest contact resistivity obtained with any material other than AuGe/Ni on n-type GaAs.
Keywords
Alloying; Conductivity; Fabrication; Gallium arsenide; Gold; Impurities; Nickel; Ohmic contacts; Tellurium; Temperature;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1983.25741
Filename
1483485
Link To Document